|
Processing
|
Item
|
Capability
|
|
Material
Feeding
|
1.Min.
board thickness
2.Copper thickness |
0.2 mm
3oz(about 2 oz need to notice) |
|
Inner layer
Circnit
|
1.Min.Line
width/distance
2.Insulation PAD
3.Min. board thickness
4.Distance between hole edge to line |
4/4 mil(1oz)
3oz copper need to report
lateral 8 mil
Lower limit 0.1 mm
Normal 7 mil |
|
Lamination
|
1.
clearance of board thickness :
below 1.27 mm
above 1.6 mm
about 2.3 mm
2. Resistance control
3. layer to layer position adjustment |
+4/-3
mil
±5 mil
±7 mil
Request value above 10%
±5 mil |
|
Drilling
|
1. Min.
hole dimension
2. hole position clearance
3. NP hole clearance
4. Drilling hole clearance
5. Distance between hole to cutting line |
0.2
mm(10 mil)need to notice
±3 mil
±2 mil
±4 mil
Normal 12 mil
lower limit 10 mil |
|
Dry film
|
1. Min.
line width/line distance
2. Min. board thickness
3. Max. board thickness
4. Max. panel size
5. Max. Tenting size Support ring
6. PAD(ring)size
7.layer to layer position adjustment
8.Max hole size of tenting
9.Surface copper thickness request 3 oz
10.Surface copper thickness reguest 2 oz |
5/5
mil(Hoz copper)
below 4/4 mil need to notice
0.4 mm (including)above
3.2 mm (including)below
605 mm (including)below
5 mm (including)below
At least 6 mil, Normal above 8 mil
lateral 5 mil, Normal 6 mil
±5 mil
1(including)*5mm(including)
UL.date code letter type.line width 15 mil
UL.date code letter type.line width 12 mil |
|
Plating
|
1st
copper thickness
2nd copper thickness
Vertical/Horizontal ratio
Etching copper thickness |
0.3
mil
Min.0.8 mil avg. value 1.0 mil
Min. request 1 mil
Normal 4(including)
over 6 need to discuss
3 oz need to notice, normal below 2 oz |
|
Solder
|
1. Min
SMT ink width
2. Single insert hole size
3. Double insert & Gold finger
4. Once tin reveal, once insert
5. Tin pad distance to gold finger top
6. Solder thickness
7. 3 oz copper thickness line |
2.5
mil
0.5 mm(including)below
0.45 mm(including)below
Double insert need to do contra-insert
1mm
0.4 mil
Solder Printing 2 times |
|
Legend
|
1.Legend
line width |
above
8 mil
above 6 mil need inspection |
|
Routing
|
1.
Bevel edge jumping cutter
2. Distance from stamp hole to breaking edge
3. Outline clearance
|
(British system) |
(Metric
system)
|
|
0.35" |
X±0.1
mm
|
|
0.39"
~ 3.9" |
XX±0.15
mm
|
| |
3.937" ~ 24" |
XXX±0.2 mm
|
4. V-CUT clearance
5. Routing hole clearance
6. Gold finger channel open clearance
7. channel open clearance
8. V-CUT copper or circuit v-cut edge
9. V-CUT rest thickness
|
0.8
mm |
 |
|
1.27 mm |
|
|
1.6 mm |
|
|
2.0 mm
|
|
|
5mm(including)
lower limit 3 mm(need to notice)
Below 2.5 mm not necessary to jumping cutter
1.Dimension:±4 mil
2.Dimension:±6 mil
3.Dimension:±8 mil
±0.1mm
Normal±8 mil
lower limit±5 mil(Note 3 pcs routing)
±0.076 mm(3 mil)
±0.1 mm(4 mil)
0.3 mm(0.8 mm)
Normal 0.4~0.5 mm(1.6 mm)
1/3 of the board thickness
|
0.25~0.4
mm |
|
|
0.3~0.4 mm |
|
|
0.4~0.5 mm |
|
|
0.5~0.6 mm
|
|
|
